Microstructure Evolution of Cu-based BMG Coating during APS Process and Phase Analysis by Nano-indentation Test
نویسندگان
چکیده
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ژورنال
عنوان ژورنال: Journal of the Korean Welding and Joining Society
سال: 2009
ISSN: 1225-6153
DOI: 10.5781/kwjs.2009.27.6.043